Snapdragon 8 Gen 2
The Snapdragon 8 Gen 2 Mobile Platform is a cutting-edge device with advanced AI capabilities, delivering accelerated performance, exceptional connectivity, and exceptional gameplay. It features the Qualcomm® AI Engine, which offers intuitive experiences like faster natural language processing, AI cinematic video capture, direct voice command of apps, and AI bots for gaming. The Snapdragon X70 5G Modem RF System also incorporates AI, making it the most advanced mobile connectivity platform ever. The camera is powered by the industry’s first Cognitive ISP, enabling real-time Semantic Segmentation for photo and video optimizations. This platform is at the heart of extraordinary experiences.
Qualcomm® Snapdragon 8 Gen 2 Artificial Intelligence (AI) Engine
| GPU Name: | Qualcomm® Adreno™ |
| CPU Name: | Qualcomm® Kryo™ |
| Qualcomm® Hexagon™ Processor Features: | Qualcomm® Snapdragon 8 Gen 2 Hexagon™ Tensor Accelerator, Dedicated power delivery system, Qualcomm® Hexagon™ Scalar Accelerator, Qualcomm® Hexagon™ Vector eXtensions (HVX), Micro Tile Inferencing, Fused AI Accelerator architecture, Hexagon Direct Link |
| Qualcomm® Sensing Hub Features: | Dual-core AI processor, Always-sensing camera |
CPU
| Name: | Qualcomm® Kryo™ |
| Architecture: | 64-bit |
| Clock Speed: | Up to 3.36 GHz |
GPU
| Name: | Qualcomm® Adreno™ |
| APIs: | Vulkan® 1.3, OpenGL® ES 3.2, OpenCL™ 2.0 FP |
Cellular Modem-RF
| Modem Name: | Snapdragon™ X70 5G Modem-RF System |
| Peak Download Speed: | Up to 10 Gbps |
| Peak Upload Speed: | Up to 3.5 Gbps |
| Cellular Modem-RF Specs: | 8 carriers (mmWave), 2×2 MIMO (mmWave), 4×4 MIMO (Sub-6) |
| Performance Enhancement Technologies: | Qualcomm® Snapdragon 8 Gen Smart Transmit™ 3.0 technology, Qualcomm® AI-Enhanced Signal Boost, Qualcomm® 5G Ultra-Low Latency Suite, Qualcomm® Wideband Envelope Tracking, Qualcomm® 5G AI Suite, Qualcomm® 5G PowerSave Gen 3 |
| Cellular Technology: | TD-SCDMA, HSPA, sub-6 GHz, FDD, 5G mmWave, NSA (non-standalone), CDMA 1x, EN-DC, EV-DO, CBRS, NR-DC (mmWave-sub6 dual connectivity), TDD, LTE, GSM/EDGE, SA (standalone), SA (standalone) mmWave, WCDMA |
| Multi SIM: | Dual SIM Dual Active (DSDA) 5G+5G and 5G+4G, Global 5G Multi-SIM |
Wi-Fi
| Wi-Fi/Bluetooth System: | Qualcomm® FastConnect™ 7800 |
| Peak Speed: | Up to 5.8 Gbps |
| Generation: | Wi-Fi 4, Wi-Fi 6, Wi-Fi 5, Wi-Fi 7 |
| Standards: | 802.11a, 802.11b, 802.11g, 802.11n, 802.11ac, 802.11ax, 802.11be |
| Spectral Bands: | 6 GHz, 2.4 GHz, 5 GHz |
| Channels: | 320 MHz |
| Peak QAM: | 4K QAM |
| Features: | Passpoint, TDLS, High Band Simultaneous (HBS) Multi-Link, Wi-Fi QoS Management, Wi-Fi Optimized Connectivity, MU-MIMO (UL/DL), Wi-Fi Aware R3, Wi-Fi Location, OFDMA (UL/DL), Miracast, Voice-Enterprise |
Bluetooth
| Wi-Fi/Bluetooth System: | Qualcomm® Snapdragon 8 Gen FastConnect™ 7800 |
| Specification Version: | Bluetooth® 5.3 |
| Topologies: | Dual Bluetooth® Radios |
| Low Energy Features: | Bluetooth® Low Energy Audio |
Location
| Location Support: | Qualcomm® Snapdragon 8 Gen Location Suite |
| Satellite Systems: | GLONASS, NavIC, Beidou, GPS, QZSS, Galileo |
| Frequency Support: | Triple |
| Accuracy: | Lane-level, Sidewalk-level |
| Features: | Global Freeway Vehicle Navigation, Concurrent satellite systems, Pedestrian Navigation |
NFC
| Near Field Communications: | Supported |
Camera
| Image Signal Processor (ISP) Name: | Qualcomm® Spectra™ |
| Image Signal Processor (ISP) Type: | Hardware Accelerator for Computer Vision (CV-ISP), Cognitive ISP (Cog ISP), Image Signal Processor (ISP) |
| Image Signal Processor (ISP) Number: | Triple ISP |
| Image Signal Processor (ISP) Bit Depth: | 18-bit |
| Single Camera (MFNR, ZSL, 30 fps): | Up to 108 MP |
| Single Camera: | Up to 200 MP |
| Features: | AI-based auto-exposure, Mega Low light photography, Engine for Visual Analytics 3.0, Multi-frame Noise Reduction (MFNR), AI-based face detection, Locally Motion Compensated Temporal Filtering (MCTF), Real-time Semantic Segmentation |
| Video Capture: | Up to 8K 30fps or 4K 120fps video capture |
| Slow Motion Video Capture: | Up to 720p @ 960 fps |
| Video Capture Formats: | Hybrid Log Gamma (HLG), Dolby Vision®, HDR10, HDR10+ |
| Video Capture Features: | Engine for Visual Analytics 3.0, Up to 4 exposures (with QDOL image sensors), Video super resolution, Computational HDR with staggered imaged sensors, Real-time Semantic Segmentation, Bokeh Engine (version 2) |
Video Playback
| Resolution: | Up to 8K @ 60 fps |
| Codecs: | Hybrid Log Gamma (HLG), HDR10+, AV1, H.264 (Advanced Video Coding (AVC)), VP9, VP8, Dolby Vision®, H.265 (High Efficiency Video Coding (HEVC)), HDR10 |
| Features: | HDR Vivid |
Display
| Maximum On-Device Display Resolution: | 4K Ultra HD @ 60 Hz, QHD+ @ 144 Hz |
| Maximum External Display Resolution: | 4K @ 60 Hz |
| High Dynamic Range (HDR): | HDR Vivid, HDR10+, HDR10 |
| Color Depth: | Up to 10-bit |
| Color Gamut: | Rec. 2020 |
Audio
| Qualcomm Aqstic™ technology support: | Qualcomm Aqstic™ audio codec, Qualcomm Aqstic™ smart speaker amplifier |
| Qualcomm® aptX™ audio technology support: | Qualcomm® aptX™ Voice, Qualcomm® aptX™ Adaptive, Qualcomm® aptX™ Lossless |
| Audio Processing Technologies: | Snapdragon Sound™ technology |
Charging
| Qualcomm® Quick Charge™ technology support: | Qualcomm® Quick Charge™ 5 technology |
Security
| Fingerprint Sensor: | Qualcomm® 3D Sonic Sensor Max, Qualcomm® 3D Sonic Sensor |
| Secure Processing Unit (SPU): | Biometric Authentication (Face), Biometric Authentication (Fingerprint), Biometric Authentication (Voice), Biometric Authentication (Iris) |
| Features: | Qualcomm® Trusted Execution Environment (TEE), Trust Management Engine, Qualcomm® Wireless Edge Services (WES), Qualcomm® Type-1 Hypervisor, Platform Security Foundations, Secure Processing Unit (SPU), Platform Security Foundations |
Memory
| Speed: | 4200 MHz |
| Type: | LPDDR5x |
Development Software
| Development Artificial Intelligence (AI): | Qualcomm® AI Stack |
Universal Serial Bus (USB)
| Interface Type: | USB-C |
| Specification Version: | USB 3.1 |
Process Node and Technology
| Process Node: | 4 nm |
Part
| Part Number(s): | SM8550-AB, SM8550-AC |
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Hello, my name is Shiv Kumar. I have a great interest in researching and studying technology. I have been working in the field of technology for a long time. I strive to deliver technology news to viewers through writing. Currently, I am working on Technical Neil website
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